Fairwaves Set to Launch XCOM Embedded x86 Platform for SDR Applications

Fairwaves designed XCOM using the COM (Carrier on Module) approach, which is why the company is offering the SDR board in several bundles using two different processors.

As mentioned earlier, XCOM comes in three different bundles:

All the bundles feature RF power amplifier control with a pair of software-controlled, high-load DCDCs to control the RF output power to the PAs, four ADCs to measure the forward and reflected power of two PAs for VSWR calculation, and GPIO to turn Pas on/off. They include miniPCIe with two PCIe lanes, and EEPROM with one write-lockable page for storing unique IDs, security keys, and other data. They are also outfitted with vertical-only connectors and passive cooling.

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